In today’s fast-paced world of technology, electronic devices are getting smaller, faster, and more powerful. Behind the scenes, one key player in making these advancements possible is BGA Assembly (Ball Grid Array Assembly). At YIC Assembly, we specialize in BGA Assembly for high-performance electronics, helping our customers bring innovative products to life. What Is BGA … Read more
Yun Industrial specializes in Surface-Mount Technology (SMT) to apply components to the surface of PCBs. Keep in mind, you will need to do your homework before you move forward in switching an existing electronic product design from through-hole technology to surface mount technology (SMT). Surface-mount technology (SMT) is a method for producing electronic circuits in which the components … Read more
When it comes to building reliable and high-performance Printed Circuit Boards (PCBs), two primary component-mounting methods dominate the industry: Through-Hole Technology (THT) and Surface Mount Technology (SMT). Each method has its advantages, disadvantages, and ideal use cases depending on the application. At Yun Industrial Acme PCB Assembly, we specialize in both techniques—because the right choice … Read more
When creating “mixed technology” printed circuit board (pcb) assemblies, once all the surface mount technology (SMT) devices are in place, there are a variety of approaches available for attaching the plated through hole (PTH) components. Traditionally these have included either an operator soldering PTH devices by hand, or utilizing automated equipment known as a wave … Read more